发明名称 Composition for polishing pad and polishing pad therewith
摘要 An objective of the present invention is to provide a composition for polishing pad that is excellent in formability, abrasion resistance and small in temperature dependence of Young's modulus and a polishing pad therewith. The composition for polishing pad of the present invention comprises a water-insoluble matrix and a water-soluble particle dispersed in the water-insoluble matrix. The water-insoluble matrix contains a crosslinked ethylene-vinyl acetate copolymer and/or a crosslinked 1,2-polybutadiene and each of these is contained by a prescribed amount against the total of the water-insoluble matrix.
申请公布号 US2004063391(A1) 申请公布日期 2004.04.01
申请号 US20030646891 申请日期 2003.08.25
申请人 JSR CORPORATION 发明人 HOSAKA YUKIO;OKAMOTO TAKAHIRO;HASEGAWA KOU;KAWAHASHI NOBUO;MORINO KATSUAKI
分类号 B24D3/00;B24B37/04;B24B37/24;B24D3/28;C08L9/00;C08L23/08;(IPC1-7):B24D11/00 主分类号 B24D3/00
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