HIGH GAIN INTEGRATED ANTENNA AND DEVICES THEREFROM

摘要

An integrated circuit (200) for wireless communications includes substrate (210), at least one integrated antenna (225, 230) formed in or on the substrate (210), and a heat sink (245). At least one dielectric propagating layer [235] is disposed between the integrated antenna (225, 230) and the heat sink (245) which provides a thermal conductivity of at least 35 W/m* K and resistivity greater than 100 Ohm-cm at 25 C. The invention can be used to establish an on-chip or inter-chip wireless link over at least a 2.2 cm distance.