METHOD FOR FORMING MICRO PATTERN USING BUCKLING PHENOMENON

摘要

PURPOSE: A method for forming a micro pattern using a buckling phenomenon is provided to simplify the forming process by using a mold having a predetermined pattern and the buckling phenomenon generated at a thin film. CONSTITUTION: A mold(108) is prepared. At this time, the mold has a convexoconcave type pattern structure. A multilayered thin film is formed at the upper portion of a substrate(102). The multilayered thin film includes a lower layer(104) and an upper layer(106). The mold contacts the multilayered thin film. The multilayered thin film is patterned to an aiming type structure by inducing the buckling phenomenon between the upper and lower layer using the stress generated at the contact surface between the upper and lower layer. Then, the mold is removed from the resultant structure.