发明名称 Method of electroless plating and apparatus for electroless plating
摘要 After an additive containing a reducing agent is supplied to an object to be treated, a solution containing metal ions such as a copper sulfate solution is supplied to the object to be treated. Since the additive and the solution containing the metal ions are separated, the composition of a plating solution is easily regulated.
申请公布号 US2004062861(A1) 申请公布日期 2004.04.01
申请号 US20030467270 申请日期 2003.08.06
申请人 SATO HIROSHI 发明人 SATO HIROSHI
分类号 C23C18/16;C23C18/18;C23C18/31;C23C18/40;H01L21/288;H01L21/768;(IPC1-7):B05D3/12;B05C15/00;B05D3/10 主分类号 C23C18/16
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