Treating copper surfaces for electronic applications

摘要

A process by which high frequency printed wiring board construction can be fabricated using smooth copper surfaces. A conductive, thin film polymer is plated on smooth copper surfaces of a core lamination. The polymer can be selected from a group of materials consisting of polypyrrole, polyaniline, polythiophene, and combinations thereof. The conductive polymer promotes adhesion between the resin polymer of the laminate and the smooth copper surfaces.