| 摘要 |
A flip chip test structure is disclosed. The flip chip test structure utilizes a substrate used in flip chip package to replace the conventional transformer of a flip chip wafer probe card. The substrate-transformer replacement reduces the cost and simplifies the flip chip wafer probe card manufacturing process since the substrate is already available and matches the chip being tested while the transformer needs additional design and custom fabrication which are expensive and time-wasting for corresponding chip being tested.
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