PRINTING PROCESS AND SOLDER MASK INK COMPOSITION

摘要

A process for making an electronic device which comprises applying a non-aqueous solder mask ink which is substantially free from organic solvent to a dielectric substrate containing electrically conductive metal circuitry, exposing the solder mask ink to actinic radiation and/or particle beam radiation optionally followed by thermal treatment, whereby the solder mask ink is applied to selected areas of the substrate under the control of a computer by ink jet printing and wherein the solder mask ink comprises the components: A) 30 - 90 parts acrylate functional monomers which are mono or higher acrylate functional monomers comprising from 5 - 95 % by weight of one or more monofunctional monomers; B) 0.1 - 30 parts metal adhesion promoting organic compound; C) 0 - 30 parts initiator; D) 0 - 10 parts polymer and/or prepolymer; E) 0 - 5 parts colorant; E) 0 - 5 parts surfactant; and Wherein all parts are by weight.