| 摘要 |
An absolute micromachined silicon pressure sensor (30) provides the resistive or piezoresistive strain gauges (48), conductive traces (52), wirebond pads (50) and other electrical components on a micromachined silicon die (32) in a location that is isolated from the sensed fluid. This protects the electronic components (48, 50, 52) from the corrosive effects of the sensed fluid. A hermetic cover (54) is provided on the backside of the silicon die (32) and is directly bonded thereto to create a hermetically sealed volume (56) of gas or vacuum.
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