发明名称 |
SPHERICAL SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME |
摘要 |
Abstract of the Disclosure A spherical semiconductor device includes a spherical semiconductor element having one or more electrodes on its surface. Spherical conductive bumps are formed at the positions of the electrodes. The electrodes are so arranged as to contact a common plane. Spherical bumps constituting a group to be connected to the outside protrude above the spherical semiconductor element such that a predetermined gap is formed between a plane or a spherical surface capable of contacting the spherical bumps and the surface of the spherical semiconductor element. The spherical semiconductor device is connected to various circuit boards or another semiconductor device through the spherical bumps. This affords easy and accurate electrical connections to the outside.
|
申请公布号 |
US2004061224(A2) |
申请公布日期 |
2004.04.01 |
申请号 |
US20020255759 |
申请日期 |
2002.09.27 |
申请人 |
NIPPON STEEL CORPORATION;BALL SEMICONDUCTOR CORPORATION |
发明人 |
TATSUMI KOHEI;SHIMOKAWA KENJI;HASHINO EIJI;TAKEDA NOBUO;FUKANO ATSUYUKI |
分类号 |
H01L23/485;H01L25/065;H01L29/06;(IPC1-7):H01L23/48 |
主分类号 |
H01L23/485 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|