发明名称 |
CELL AND CELL PACK |
摘要 |
<p>A cell and a cell pack including a secondary cell (2) and a circuit substrate (3) which are made into a unitary block by a resin mold body (11). Resin is filled between the secondary cell (2) and the substrate (3) which is electrically connected to the secondary cell (2) so as to make them into a unitary cell or cell pack. The secondary cell (2) has an engagement member (26) and the resin mold body (11) filled and formed on it has an anchorage effect. Accordingly, the resin mold body (11) is fixedly attached to the secondary cell (2). Moreover, it is possible to install a thermo-sensitive element on the circuit substrate (3) or in the resin-filled space.</p> |
申请公布号 |
EP1403942(A1) |
申请公布日期 |
2004.03.31 |
申请号 |
EP20020738836 |
申请日期 |
2002.06.27 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
MASUMOTO, KENJIN;KOZU, KATSUMI;TSURUTA, KUNIO |
分类号 |
H01M2/30;H01M2/10;H01M6/50;H01M10/48;(IPC1-7):H01M2/10 |
主分类号 |
H01M2/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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