METHOD FOR PRODUCING MINIATURE AMPLIFIER AND SIGNAL PROCESSING UNIT

摘要

A method for producing miniature amplifier and signal processing unit includes the steps of: producing arrays of individual integrated circuits on a side of a wafer, where each circuit has a number of I/O connection points; providing a number of solder connection pads at each integrated circuit for redistribution of the I/O connection points of the integrated circuit; coating the side of the wafer having the solder connection pads with a protection coating and ensuing through going apertures in the coating to provide electrical contact with the solder connection pads; applying electrical components onto the coating and gaining electrical contact with the solder connection pads through the apertures of the coating material; and singulating the individual amplifiers from the wafer and ensuring light protection of the edges and possible unprotected side of the amplifiers.