| 摘要 |
PROBLEM TO BE SOLVED: To certainly mold a resin without generating resin flash. SOLUTION: A resin molding apparatus for clamping an article to be molded by upper and lower molds 20a, 20b through the self-adhesive film 40 bonded to one surface of the article to be molded to mold a resin is equipped with a press part which is provided with the upper and lower molds 20a, 20b one of which is provided with an air suction hole allowed to communicate with an air mechanism to draw the self-adhesive film 40 to a clamp surface and the other one of which has a resin molding cavity formed thereto, an in-loader part for supplying the article to be molded and a molding resin material to the press part, an unloader part for feeding out the molded article molded in the press part from the press part, self-adhesive film supply mechanisms 42, 43, 44 for supplying the long self-adhesive film 40 to the clamp surface of one mold mounted on the press part so as to turn the self-adhesive part bonded to the article to be molded to the other mold and a peeling mechanism for peeling the self-adhesive film from the molded article after resin molding. |
