| 摘要 |
PURPOSE: A method is provided to reduce manufacturing procedures and costs, and achieve improved yield rate of a circuit board by accurately exposing the preset positions of conductive traces formed on the circuit board. CONSTITUTION: A method comprises a step of manufacturing a core layer(20) having a plurality of conductive traces(21) formed on at least one surface of the core layer, and coating an insulating material on terminals(210) of conductive traces; a step of permitting a non-solder material(24) to cover the surface of the core layer excluding an insulating material(22), so as to expose the insulating material outward from the non-solder material, and coating a non-solder material on the surface of the core layer where conductive traces are formed; and a step of removing the insulating material from the core layer so as to expose terminals of conductive traces.
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