Thermally conductive moulded heat sink

摘要

A cooling apparatus for cooling an electrical device 1 using a flow of coolant comprises a cooling unit 3. The cooling unit 3 is in contact with the device 1 and includes a channel 6 for transporting the coolant past the device 1. In a preferred embodiment, the sectional area of the channel 6 decreases between the inlet and the outlet of the channel 6. The velocity of the flow of coolant past the device 1 can be modified, thus improving the efficiency of cooling.