| 摘要 |
PURPOSE: A semiconductor package is provided to stack semiconductor packages by a pin-to-pin method by using a solder ball and a solder post exposed to the upper and lower surfaces of the semiconductor package. CONSTITUTION: Polyimide tape is prepared. A chip mounting region is formed on the upper surface of the polyimide tape. A circuit pattern is formed on the upper surface of the polyimide tape in the outside of the chip mounting region, including a board pad formed near the chip mounting region and a solder ball pad connected to the board pad. A via hole is formed to expose the solder pad to the lower surface of the polyimide tape. A tape circuit board includes the polyimide tape, the chip mounting region and the circuit pattern. A semiconductor chip is attached to the chip mounting region of the tape circuit board. A bonding wire electrically connects the circuit pad with the semiconductor chip. A resin encapsulation part of liquid molding resin is formed to protect the semiconductor chip and the bonding wire formed on the upper surface of the tape circuit board from the outside. A connection hole is formed in the resin encapsulation part, corresponding to each solder ball pad. A solder post(50a,50b) is filled in the connection hole to be electrically connected to the solder ball pad. A solder ball(60a,60b) is connected to the solder ball pad through the via hole of the tape circuit board. |
