Resist pattern thickening material, process for forming resist pattern, and process for manufacturing semiconductor device

摘要

A resist-pattern-thickening material consists of resin and surfactant. The resist-pattern-thickening material may be water-soluble and/or alkali-soluble. Independent claims are also included for: (a) formation of resist pattern by forming a resist pattern to be thickened (3) on underlying layer (5), coating a resist-pattern-thickening material (1) to cover a surface of the resist pattern to be thickened, and forming a resist pattern (10); and (b) fabrication of semiconductor device by forming a resist pattern, and patterning the underlying layer by etching using the resist pattern.