发明名称 |
Flash memory device and method for fabricating the same |
摘要 |
A flash memory device having improved gate capacitive coupling ratio between a floating gate and a control gate and a fabrication method therefor. The disclosed flash memory device comprises a semiconductor substrate having a first trench with a width including an active region and an isolation region at either side thereof; an isolation layer formed on the isolation regions of the first trench; a second trench in the first trench defined by the isolation layer and exposing only the active region; a groove-shaped floating gate formed on the surface of the second trench and having a tunnel oxide layer on the lower part thereof; a control gate formed on the floating gate and having a gate insulating layer on the lower part thereof; a source region and a drain region formed in the substrate at both sides of the floating gate; and metal wirings formed to be in contact with the source and drain regions, respectively, through the isolation layer on the substrate.
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申请公布号 |
US6713336(B2) |
申请公布日期 |
2004.03.30 |
申请号 |
US20030374131 |
申请日期 |
2003.02.27 |
申请人 |
HYNIX SEMICONDUCTOR INC. |
发明人 |
SHIN SUNG HUN;EOM JAE DOO |
分类号 |
H01L21/8247;H01L21/28;H01L21/336;H01L27/115;H01L29/423;H01L29/788;H01L29/792;(IPC1-7):H01L21/823 |
主分类号 |
H01L21/8247 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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