| 摘要 |
A embedded resistor printed circuit board fabrication includes the steps of preparing a substrate having a top conductive layer and a bottom insulating layer and etching the top conductive layer to form a first conductive layer having recesses in it; embedding resistive material in the recesses, enabling the first conductive layer to be electrically connected to lateral sides of the resistive material; plating a thin conductive film on the first conductive layer and the resistive material to form a second conductive layer; and etching the first conductive layer and second conductive layer to let the second conductive layer be electrically connected to the thin film type resistors.
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