Semiconductor device having semiconductor element housed in packed with heat sink

摘要

A high power semiconductor device comprising a heat sink on which a semiconductor element is mounted, and a sidewall which is attached onto the heat sink and which surrounds the semiconductor element. One of the heat sink and the sidewall has a plurality of projections formed on a joining surface thereof to be joined to an opposing surface of the other one of the heat sink and the sidewall. A gap is formed by the projections between the sidewall and the heat sink when the sidewall is disposed on the heat sink. The sidewall and the heat sink are joined together by thermally curing low elasticity liquid resin which fills at least the gap formed by the projections between the sidewall and the heat sink. The projections are formed, for example, on the heat sink.