发明名称 |
Method of making metal core substrate printed circuit wiring board enabling thermally enhanced ball grid array (BGA) packages |
摘要 |
A method of making a thermally enhanced BGA substrate in which a metal (copper) core, has dielectric layers applied to each side thereof and conductive through-core build-up vias are provided. Rigidifying non-conductive dielectric sheets are laminated to the oppositely facing surfaces and then conductive layers are applied to at least one of the rigidifying non-conductive sheets and via connections are made through the dielectric layer(s) to the core conductive layer.
|
申请公布号 |
US6711812(B1) |
申请公布日期 |
2004.03.30 |
申请号 |
US20000544263 |
申请日期 |
2000.04.06 |
申请人 |
UNICAP ELECTRONICS INDUSTRIAL CORPORATION |
发明人 |
LU JANE;WU PAUL;CHEN RAY;CHEN SCOTT;CHANG JEFF |
分类号 |
H05K1/05;H01L23/12;H01L23/367;H05K1/11;H05K3/40;H05K3/42;H05K3/44;H05K3/46;(IPC1-7):H01K3/10 |
主分类号 |
H05K1/05 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|