| 摘要 |
An electronic assembly includes one or more discrete capacitors (506, 804, 1204), which are vertically connected to a housing, such as an integrated circuit package (1704). Surface mounted capacitors (506) are vertically connected to pads (602) on a top or bottom surface of the package. Embedded capacitors (804, 1204) are vertically connected to vias (808, 816, 1210, and/or 1212) or other conductive structures within the package. Vertically connecting a surface mounted or embedded capacitor involves aligning (1604) side segments (416) of some of the capacitor's terminals with the conductive structures (e.g., pads, vias or other structures) so that the side of the capacitor upon which the side segments reside is substantially parallel with the top or bottom surface of the package. Where a capacitor includes extended terminals (1208), the capacitor can be embedded so that the extended terminals provide additional current shunts through the package.
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