发明名称 Wiring board with terminals and method for manufacturing the same
摘要 In a wiring board having a terminal for connection of circuits in a variety of electronic devices, a joining section of the terminal is placed on a connecting section of a wiring pattern on the top surface of a lower substrate, two layers of adhesives having different softening temperatures are formed between the lower substrate and an upper substrate, and the lower substrate and the upper substrate are cemented sandwiching the joining section. With this structure, a stable holding force can be secured over a wide temperature range.
申请公布号 US6713683(B2) 申请公布日期 2004.03.30
申请号 US20020270180 申请日期 2002.10.15
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 TAKENAKA MASATOSHI;OKUMA SHINJI
分类号 C09J201/00;H01R4/04;H01R43/20;H05K1/18;H05K3/28;H05K3/32;(IPC1-7):H05K7/06;H05K3/38 主分类号 C09J201/00
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