| 摘要 |
A manufacturing pallet 100 has provisions for supporting an opto-electronic package 10 on a frame 112. Openings 110A, 110B are provided through the frame to enable mechanical access to the opto-electronic package from below the frame. Additionally, lead access openings 114A, 114B are provided to enable electrical access to the leads 12 of the package 10. As a result, the opto-electronic package need not be manipulated. Instead, the package can be carried on the frame, which is then installed directly on top of a given machine. The machine mechanically engages the package via the openings.
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