发明名称 |
Semiconductor-chip mounting substrate having at least one projection thereon and a pressure holding means |
摘要 |
A semiconductor-chip mounting substrate with a high degree of reliability of an electrical connection between a substrate and a semiconductor chip such as IC chips is provided. The substrate has at least one projection thereon, which is integrally molded with the substrate. A conductive layer is formed on the projection to obtain a first bump. The semiconductor chip has a terminal projecting as a second bump on its surface. The semiconductor chip is mounted on the substrate such that the first bump contacts the second bump. A required contact pressure between the first bump and the second bump is held by use of a pressure holding means.
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申请公布号 |
US6713844(B2) |
申请公布日期 |
2004.03.30 |
申请号 |
US20010026639 |
申请日期 |
2001.12.27 |
申请人 |
MATSUSHITA ELECTRIC WORKS, LTD. |
发明人 |
TATSUTA JUN;KUBO MASAO;KIDA SHINOBU;TAKAMI SHIGENARI;KUZUHARA IKKO;TANAKA KYOJI;SANAGAWA YOSHIHARU |
分类号 |
H01L21/56;H01L23/13;H01L23/498;H01L25/10;H01L33/62;(IPC1-7):H01L23/48 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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