发明名称 Manifold system having flow control
摘要 An injection molding apparatus and method are provided in which the rate of material flow during an injection cycle is controlled. According to one preferred embodiment, an injection molding apparatus is provided that includes a manifold, at least one injection nozzle coupled to the manifold, an actuator, and a valve pin adapted to reciprocate through the manifold and the injection nozzle. The valve pin has a first end coupled to the actuator, a second end that closes the gate in a forward position, and a control surface intermediate said first and second ends for adjusting the rate of material flow during an injection cycle. Retracting the valve pin tends to decrease the rate of material flow during the injection cycle and displacing the valve pin toward the gate tends to increase the rate of material flow during the injection cycle.
申请公布号 US6713002(B2) 申请公布日期 2004.03.30
申请号 US20030355514 申请日期 2003.01.31
申请人 SYNVENTIVE MOLDING SOLUTIONS 发明人 KAZMER DAVID;MOSS MARK D;DOYLE MARK;VAN GEEL HUIP
分类号 B29C45/27;B29C45/28;B29C45/30;B29C45/76;B29C45/77;(IPC1-7):B29C45/22;B29C45/23 主分类号 B29C45/27
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