| 摘要 |
The invention relates to a semiconductor device ( 10 ) comprising a semiconductor element ( 1 ), particularly a solid-state image sensor ( 1 ), comprising a semiconductor body ( 11 ) of which one surface comprises an optically active part ( 1 A) and an optically inactive part ( 1 B) within which electrical connection regions ( 2 ) of the optoelectronic semiconductor element ( 1 ) are present, while a body ( 3 ) is present above the optically active area ( 1 A) of the surface of the semiconductor body ( 11 ) comprising an optical component ( 3 B). According to the invention the body ( 3 ) comprises an optically transparent foil ( 3 ) which is present on the optically active part ( 1 A) of the surface of the semiconductor body ( 11 ) and which is attached thereto with an optically transparent adhesive layer ( 4 ) and in which the optical component ( 3 B) is formed. The device ( 10 ) is very stable, compact and easy to manufacture, that is to say in batches. For example a component ( 3 B) such as a lens ( 3 B) may easily be formed by pressing a suitably formed die ( 13 ) into the foil ( 3 ). A method according to the invention for manufacturing the device according to the invention is cost-effective and easy. |
