发明名称 RESIN COMPOSITION
摘要 PURPOSE: To provide a photosensitive resin composition which achieves high resolution, particularly a colored photosensitive resin composition which achieves high resolution even when a pigment of a small particle diameter is used at a high concentration. CONSTITUTION: The resin composition comprises a polycarboxylic acid resin obtained by reacting (a1) an epoxy compound having at least two epoxy groups per molecule with (a2) a polycarboxylic acid under such conditions as to satisfy the expression (the number of epoxy equivalents of the epoxy compound)>(the number of carboxylic acid equivalents of the polycarboxylic acid) to obtain a reaction product (a), which is brought into reaction with (b) an unsaturated group-containing monocarboxylic acid to obtain (c) a reaction product, and further reacting (c) the reaction product with (d) an acid anhydride.
申请公布号 KR20040026113(A) 申请公布日期 2004.03.27
申请号 KR20030045782 申请日期 2003.07.07
申请人 SUMITOMO CHEMICAL CO., LTD. 发明人 NAKAI HIDEYUKI;INOUE MASATO;MURO SEIJI
分类号 G03F7/027;C08F290/06;C08G59/16;G03F7/004;(IPC1-7):G03F7/004 主分类号 G03F7/027
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