| 摘要 |
PROBLEM TO BE SOLVED: To provide a laminated ceramic electronic component fabricating process in which delamination and a crack are hard to occur. SOLUTION: The laminated ceramic electronic component fabricating process is provided by which a plurality of sheets of composite structures 14, equipped with a ceramic green sheet 11, a conductive paste film 12 formed with predetermined patterns on the ceramic sheet 11, and an unevenness absorbing ceramic green layer 13 formed by applying ceramic paste on the ceramic green sheet 11 so as to reduce the unevenness resulting from a thickness of the conductive paste film 12, piled up to construct a green laminated body to be baked. In the fabricating process, a ceramic paste is used which contains ceramic powders covered with a glass film composed of glass at least whose surface part has a softening temperature of 550 to 850°C. COPYRIGHT: (C)2004,JPO
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