发明名称 |
Semiconductor chip electronic component with current input and output conductor |
摘要 |
The component has a circuit element with at least one connectable electrode (2). Around the electrode is deposited an insulation layer (2a) before a conductor (4) has contacted the electrode and has been set onto the insulation layer. The insulation layer is rendered conductive by heating. The insulation layer and the conductor are electrochemically coupled such that these is an electric connection between the conductor and electrode. Pref. the insulation layer is deposited onto a semiconductor chip surface onto a region outside the electrode formed on the chip. Onto the insulation layer are set conductors, extending from a conductor frame. |
申请公布号 |
DE19549563(B4) |
申请公布日期 |
2004.03.25 |
申请号 |
DE1995149563 |
申请日期 |
1995.07.12 |
申请人 |
MITSUBISHI DENKI K.K., TOKIO/TOKYO |
发明人 |
TAKAHASHI, YOSHIHARU;SHINOHARA, TOSHIAKI |
分类号 |
H01L21/56;H01L21/60;H01L21/607;H01L23/31;H01L23/495 |
主分类号 |
H01L21/56 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|