| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve a problem that the electrode of a semiconductor chip and an inner lead are connected through a metallic fine wire whereby the loss of a signal in the metallic fine wire becomes a problem under a state wherein a high-speed signal or a high-frequency signal is operated thereby disabling the function of a semiconductor chip from being sufficiently developed. <P>SOLUTION: A conductive bump 20 is formed on the electrode 19 of the semiconductor chip 18 and a plurality of inner leads 21, extended to the outer part of the peripheral rim of the semiconductor chip 18, are connected to the conductive bump 20 while the surface of the plurality of inner leads 21 is provided with a projection 22, projected more outward than the peripheral rim of the semiconductor chip 18, and a region comprising the conductive bump 20 on the surface of the semiconductor chip 18 is sealed by sealing resin 23, however, at least the surface of the projection 22 is exposed from the sealing resin 23. <P>COPYRIGHT: (C)2004,JPO |
