| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent polishing unevenness caused by local recesses formed in a glass substrate after polishing in a single-side polishing device comprising a pressure surface table and a back pad formed of a soft resin foam sheet and stuck to the pressure lap, on the upper side and a rotatable polishing machine and abrasive cloth stuck thereto, on the lower side to polish the surface of a plate body such as the glass substrate or a wafer. <P>SOLUTION: The pressure lap 1 with linear recesses 2 machined on the lower face continuously from the lower face side inner part to the outer peripheral part, or a pressure lap with the whole lower face side machined in a polishing face state, is used to prevent the bite of air when sticking the back pad to the pressure lap, which causes polishing unevenness. <P>COPYRIGHT: (C)2004,JPO |
