发明名称 VACUUM CHUCK
摘要 PROBLEM TO BE SOLVED: To provide a vacuum chuck for easily handling grinding chips at low cost, obtaining large adsorption force with small sucking force, and preventing the occurrence of distortion of the adsorbing surface. SOLUTION: A number of air suction holes 2 are bored in the top surface of a chuck body 1. A vacuum ejector 3 for sucking air from the air suction holes 2 by compressed air supplied from the outside is provided on the side of the chuck body 1. A workpiece 7 is adsorbed on the top surface of the chuck body 1 by sucking action of the vacuum ejector 3. The chuck body 1 is formed of pure metallic material. The air suction holes 2 are communicated with each other by lateral holes 4 bored vertically and horizontally in a plan view from the side of the chuck body 1. The end part 4a of the lateral hole 4 opened to the side of the chuck body 1 is closed, and the vacuum ejector 3 and the air suction holes 2 are communicated with each other through the lateral hole 4. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004090118(A) 申请公布日期 2004.03.25
申请号 JP20020252578 申请日期 2002.08.30
申请人 KOSHIN:KK 发明人 TAKASE KAZUTARO
分类号 B23Q3/08;B23Q3/18;(IPC1-7):B23Q3/08 主分类号 B23Q3/08
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