| 摘要 |
PROBLEM TO BE SOLVED: To provide a bonding apparatus and a bonding tool of an electronic component which can control, as much as possible, stress generated at a heating portion to heat the bonding tool to a smaller value. SOLUTION: The bonding apparatus is provided with the bonding tool 14 which is in contact with the electronic component 40 and a pressing means to press the bonding tool 14 to the electronic component 40. The bonding tool 14 is provided with a rectangular horn 15, a vibrator 17 which gives vibration to the horn 15, a pressure-bonding portion 30 which is provided at the antinode of a vibration wave W of the horn 15 to bond the electronic component 40, and a heater 50 which is provided at an area corresponding to the antinode of the vibration wave W of the horn 15 to heat the horn 15. Since the stress generated at the area corresponding to the antinode of the vibration wave W is rather small, damage applied on the heater 50 is small and its operation life can therefore be extended. COPYRIGHT: (C)2004,JPO
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