发明名称 |
Platinum alloy using electrochemical deposition |
摘要 |
The present invention is directed to methods and compositions for depositing a noble metal alloy onto a microelectronic workpiece. In one particular aspect of the invention, a platinum metal alloy is electrochemically deposited on a surface of the workpiece from an acidic plating composition. The plated compositions when combined with high-k dielectric material are useful in capacitor structures.
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申请公布号 |
US2004055895(A1) |
申请公布日期 |
2004.03.25 |
申请号 |
US20030667802 |
申请日期 |
2003.09.22 |
申请人 |
SEMITOOL, INC. |
发明人 |
HU ZHONGMIN;RITZDORF THOMAS L.;GRAHAM LYNDON W. |
分类号 |
C25D7/12;H01L21/288;(IPC1-7):C25D3/50;C25D7/06;C25D3/56 |
主分类号 |
C25D7/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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