| 摘要 |
A polishing media for chemical mechanical planarization (CMP) includes a layer comprised of a CMP pad material having a water-soluble material comprised of cyclodextrin dispersed therein. The layer may form part of a pad configured for rotary CMP or part of a belt pad configured for linear CMP. In one method for conducting a CMP operation, a polishing media having a layer comprised of a CMP pad material with a water-soluble material comprised of cyclodextrin dispersed therein is contacted with a slurry, water, or an aqueous solution to remove the water-soluble material comprised of cyclodextrin from the CMP pad material. In another method, the water-soluble material comprised of cyclodextrin is removed from the CMP pad material before the CMP operation.
|
