METHOD FOR CONTROLLING PROBE TIP SENDING IN SEMICONDUCTOR TEST SYSTEM AND SANDING CONTROL APPARATUS

摘要

PURPOSE: A method for controlling probe tip sending in semiconductor test system and the sanding control apparatus are provided to enhance the throughput of semiconductor device by removing abnormal contact elements in an electrical die sorting process. CONSTITUTION: A measuring process is performed to measure resistant values of all pads of a chip probed under a wafer level and to store the measured resistant values(S92). A continuous fail counting value and a cumulative fail counting value are increased if the maximum resistant value of the stored resistant values is more than a reference value of a contact resistance(S93,S94,S95). An automatic sensing command is generated and a probe tip is sent automatically if the continuous fail counting value or the cumulative fail counting value is more than the reference value(S96,S98).