发明名称 METHOD FOR PREDICTING FILM THICKNESS AND DEPOSITION METHOD
摘要 PROBLEM TO BE SOLVED: To provide a method for predicting film thicknesses capable of predicting the film thicknesses with good accuracy when a collimator is disposed between a target and a substrate and thin films are formed by sputtering and a deposition method which can form the thin films having a uniform film thickness distribution. SOLUTION: The thickness of the thin films formed by the sputtered particles arriving at the substrate 4 from the target 2 at an arbitrary point Q on the substrate is determined by geometrically determining a region (visual field region) s on the target 2 which can be overlooked beyond a plurality of apertures 7 of a collimator 6 from the arbitrary point Q on the substrate 4 and integrating the erosion region of the target 2 superposed on the visual field region s. Also, the prediction of the film thickness of the case the deposition is performed while shielding the prescribed aperture is made possible by subtracting the thickness of the films formed by the sputtered particles arriving at the arbitrary point on the substrate through the prescribed aperture from the total sum film thickness at the arbitrary point. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004091891(A) 申请公布日期 2004.03.25
申请号 JP20020256888 申请日期 2002.09.02
申请人 MURATA MFG CO LTD 发明人 UEDA YASUHIKO
分类号 C23C14/34;(IPC1-7):C23C14/34 主分类号 C23C14/34
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