| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a multilayer substrate whose electric connecting performance, heat radiating performance, and signal transmitting performance is excellent, and to provide a method for efficiently manufacturing the multi-layer substrate. <P>SOLUTION: This multi-layer substrate 1 is provided with an insulating substrate 11 constituted of insulating materials, at least two circuit layers 13 constituted of conductor patterns arranged on the insulating substrate, and a conductive path 14 mutually connecting the circuit layers. In this case, an outline degree decided by the JISB0621 of the outer peripheral face of the conductive path ranges from 1μm to 10μm. <P>COPYRIGHT: (C)2004,JPO</p> |
