RESIN SEALED SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a resin sealed semiconductor device that is small and very reliable and actually does not require mounting manhours by incorporating components such as a transformer and a choke coil. SOLUTION: This resin sealed semiconductor device has an insulation sheet on the semiconductor chip with a magnetic material adhered on it. The above semiconductor chip patterns are connected with a bonding wire surrounding the above magnetic material and resin sealed. The magnetic material is formed like a doughnut and the semiconductor chip patterns can be connected with a bonding wire to straddle the above magnetic material between the inside and the outside of the doughnut. COPYRIGHT: (C)2004,JPO