| 摘要 |
PROBLEM TO BE SOLVED: To reduce the height of a module component and to realize a sufficient shielding effect for the module component. SOLUTION: The module component has such a structure that packaging components 3 which are electronic components are mounted on a circuit board 1, the packaging components 3 are sealed with a sealing body 4 formed of a first resin and having the same outer shape as that of the circuit board 1, a front surface of the sealing body 4 is covered with a metal film 2, and a ground pattern 5 is formed in the periphery of a front surface of the circuit board 1 with a conduction path formed between the metal film 2 and the ground pattern 5. The module component is thin and is perfectly shielded. COPYRIGHT: (C)2004,JPO
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