| 摘要 |
PROBLEM TO BE SOLVED: To enhance the reliability of an optical semiconductor module by relaxing the thermal stress at the joint of respective members of the optical semiconductor module. SOLUTION: In the optical semiconductor module, the melting point of a first material 21 for bonding the bottom plate 2 and the frame 1 of an optical semiconductor container is set in the range of 180°C-810°C the melting point of a second material 22 for bonding the insulator substrate 12a of an electronic cooling element and a thermoelectric element 11 is set in the range of 180°C-370°C, melting point of a third material 23 for bonding an insulator substrate 12b and the thermoelectric element 11 is set in the range of 180°C-370°C, the melting point of a fourth material 24 for securing the electronic cooling element and the bottom plate 2 is set in the range of 130°C-240°C, and the melting point of a fifth material for bonding a board 16 mounting a semiconductor element 15 and the like with the insulator substrate 12a is set in the range of 110°C-180°C. COPYRIGHT: (C)2004,JPO
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