| 摘要 |
An electronic apparatus, comprising: a plate-like container, enclosing a heat-accumulating material of latent heat type within an inside thereof; a semiconductor element, being connected with said container, thermally; and a housing covering said semiconductor element and said container, wherein a surface of said container, in contact with said semiconductor element, is provided with recess portions in plural numbers thereof, each being recessed in a direction of said heat-accumulating material of latent heat type, so as to enclose said heat-accumulating material of latent heat type into said recess portions, and said plate-like container and said housing are connected with each other, thermally, thereby providing a cooling device, being able to cool the electronic circuit component(s) building up the electronic apparatus, as well as being superior in operability.
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