| 摘要 |
A passivation structure capping an electrical device disposed on a substrate is introduced. The passivation structure includes a first diamond-like carbon film covering a top surface and the sidewall of the electrical device and the surface of the substrate, a buffer layer positioned on the first diamond-like carbon film, and a second diamond-like carbon film positioned on the buffer layer. Part of the second diamond-like carbon film covers the first diamond-like carbon film directly to form a cyclic structure.
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