| 摘要 |
A stamper forming method, including the following steps: coating a first photoresist on a substrate, coating a stop layer on the first photoresist, coating a second photoresist on the stop layer, exposing the second photoresist by using a beam of light, exposing the first photoresist by using another beam of light, developing the first photoresist and the second photoresist, and sputtering a metal layer over the second photoresist. The invention also discloses another stamper forming method.
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