发明名称 METHOD OF PRODUCING A CONTACTLESS CHIP CARD OR A CONTACT/CONTACTLESS HYBRID CHIP CARD WITH IMPROVED FLATNESS
摘要 <p>The invention relates to a method of producing a chip card comprising an antenna support, two card bodies and an electronic module or a chip which is connected to the antenna. The inventive method comprises: a first lamination step consisting in soldering two thermoplastic sheets (32, 34 or 62, 64) to each side of the antenna support (10 or 40) at a temperature that makes the material used for said sheets soften and flow completely, such that any differences in the thickness of the antenna support disappear; and a second lamination step which is performed after the time required for the thermoplastic sheets (32, 34 or 62, 64) to solidify, said second step consisting in hot press soldering two plastic layers (36, 38 or 66, 68) forming the card bodies to the flat plastic-coated faces of the uniform-thickness, plastic-coated antenna support (30 or 60).</p>
申请公布号 WO2004025553(A1) 申请公布日期 2004.03.25
申请号 WO2003FR02701 申请日期 2003.09.12
申请人 ASK S.A.;KAYANAKIS, GEORGES;BENATO, PIERRE;HALOPE, CHRISTOPHE 发明人 KAYANAKIS, GEORGES;BENATO, PIERRE;HALOPE, CHRISTOPHE
分类号 B42D15/10;B32B37/00;B32B37/02;B32B37/20;G06K19/07;G06K19/077;(IPC1-7):G06K19/077 主分类号 B42D15/10
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