发明名称
摘要 An electronic circuit part mounting machine capable of accurately inspecting a part mounting accuracy, wherein a large number of parts (20) are mounted on the upward part mounting surface of an inspected substrate (300), the inspected substrate (300) is made of a transparent material, a pressure sensitive adhesive double coated tape made of a transparent material is stuck on the part mounting surface, and the parts are pressingly fixed to the adhesive double coated tape, circular marks (302) are formed on a large number of lattice points on the inspected substrate (300) and the parts (20) are mounted on the inspected substrate (300) at predicted mounting positions apart equal distances from four circular marks (302) adjacent to each other, the inspected substrate (300) is inversed upside down and held on a wiring board holding device (18) through an inspection jig (304), and the parts (20) and the circular marks (302) around the periphery thereof are imaged by a reference mark camera (152) from the rear side of the parts through the inspected substrate (300) and the pressure sensitive adhesive double coated tape to detect the mounting positions of the parts (20) based on the relative position of the parts (20) to the circular marks (302).
申请公布号 JP2004095672(K1) 申请公布日期 2004.03.25
申请号 JP20020251698 申请日期 2002.08.29
申请人 发明人
分类号 G01B11/00;H05K1/02;H05K13/04;H05K13/08 主分类号 G01B11/00
代理机构 代理人
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