发明名称 |
MOLD FOR MOLDING AND METHOD FOR MANUFACTURING APPARATUS FOR MIXED INTEGRATED CIRCUIT USING IT |
摘要 |
PROBLEM TO BE SOLVED: To perform stable molding using a mold 20 for molding. SOLUTION: Cavities 25 are provided in parallel on the peripheral part of the mold 20 for molding. Two pots 27 are provided to one cavity 25. The pots 27 and the cavity 25 are communicated with each other through runners 26. Tablets 29 by two are fed into each of the pots 27. The tablets 29 fed into two pots 27 are simultaneously pressed by using a plunger. As distances from each cavity 25 to the pots 27 are equal, a stable resin molding can be performed. COPYRIGHT: (C)2004,JPO |
申请公布号 |
JP2004090371(A) |
申请公布日期 |
2004.03.25 |
申请号 |
JP20020253986 |
申请日期 |
2002.08.30 |
申请人 |
SANYO ELECTRIC CO LTD |
发明人 |
SAITO HIDESHI;MOGI MASAMI;MINO KATSUYOSHI |
分类号 |
B29C45/26;B29C45/02;B29C45/14;B29L31/34;H01L21/56;H05K3/00;(IPC1-7):B29C45/26 |
主分类号 |
B29C45/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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