发明名称 MOLD FOR MOLDING AND METHOD FOR MANUFACTURING APPARATUS FOR MIXED INTEGRATED CIRCUIT USING IT
摘要 PROBLEM TO BE SOLVED: To perform stable molding using a mold 20 for molding. SOLUTION: Cavities 25 are provided in parallel on the peripheral part of the mold 20 for molding. Two pots 27 are provided to one cavity 25. The pots 27 and the cavity 25 are communicated with each other through runners 26. Tablets 29 by two are fed into each of the pots 27. The tablets 29 fed into two pots 27 are simultaneously pressed by using a plunger. As distances from each cavity 25 to the pots 27 are equal, a stable resin molding can be performed. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004090371(A) 申请公布日期 2004.03.25
申请号 JP20020253986 申请日期 2002.08.30
申请人 SANYO ELECTRIC CO LTD 发明人 SAITO HIDESHI;MOGI MASAMI;MINO KATSUYOSHI
分类号 B29C45/26;B29C45/02;B29C45/14;B29L31/34;H01L21/56;H05K3/00;(IPC1-7):B29C45/26 主分类号 B29C45/26
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