发明名称 PEELING LIQUID COMPOSITION FOR PHOTORESIST
摘要 PROBLEM TO BE SOLVED: To provide a peeling liquid composition for photoresist, which exhibits superior peeling performance for a thick-film photoresist, does not solidify even at low temperature, and also has superior characteristics as to toxicity and environmental pollution. SOLUTION: The peeling liquid composition for photoresist is used to peel a patterned hardened body, formed of a photoresist on a substrate, off the substrate, and contains 60 to 95 wt.% N-methyl pyrrolidone, 1 to 20 wt.% diethanolamine and/or triethanolamine, 0.1 to 5 wt.% tetra(substituted)alkyl ammonium hydroxide, and 0.3 to 20 wt.% alcohol in 100 wt.% of the composition. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004093678(A) 申请公布日期 2004.03.25
申请号 JP20020251694 申请日期 2002.08.29
申请人 JSR CORP 发明人 NISHIMURA YOKO;INOUE MASAAKI
分类号 G03F7/42;H01L21/027;(IPC1-7):G03F7/42 主分类号 G03F7/42
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