| 摘要 |
PROBLEM TO BE SOLVED: To provide a BGA optical semiconductor hermetic sealed container in which hermetic seal can be ensured at the through hole part of a BGA electrode while preventing warp of a bottom plate, and to provide an optical semiconductor module employing that optical semiconductor hermetic sealed container. SOLUTION: The optical semiconductor hermetic sealed container comprises a first bottom plate 11 of metal secured to a frame 1, and a second bottom plate 12 composed of ceramics having a Young's modulus higher than that of the first bottom plate 11 and secured to the first bottom plate 11 on the side opposite to the frame 1. The second bottom plate 12 is provided on the surface thereof opposite to the frame 1 with a large number of electrodes 13 conducting between the upper and lower surfaces of the second bottom plate 12 electrically. The electrode 13 extends onto the upper and lower surfaces of the second bottom plate 12 while covering the opening of a through hole, and seals the through hole hermetically. COPYRIGHT: (C)2004,JPO
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