发明名称 ELECTRONIC PART PACKAGING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide an electronic part packaging apparatus which can flexibly increase or decrease the number of workers following the change in the number of products. <P>SOLUTION: The electronic part packaging apparatus includes a packaging facility 1 for packaging an electronic part on a printed board by the manual work of a worker H, a solder tank 2 for soldering the packaged part to the board, and a processing facility 3 for visually confirming the soldered state of the soldered part by the worker H as needed to correct it. These elements are arranged in a series of a line in this order. A return conveyor 4 is interposed between the facility 1 and the facility 3 to align the facility 1 and the facility 3 near at each other so that the conveyor lines of them moves in a reverse direction (&alpha;, &beta;). <P>COPYRIGHT: (C)2004,JPO
申请公布号 JP2004095779(A) 申请公布日期 2004.03.25
申请号 JP20020253826 申请日期 2002.08.30
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 NISHII YUTAKA
分类号 G05B19/418;H05K13/00;H05K13/04 主分类号 G05B19/418
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